A few days back, it was confirmed that the forthcoming Meizu Pro 6 handset will be fueled by the latest MediaTek Helio X25 10-core SoC instead of Samsung Exynos 8870 processor being suggested earlier. In a fresh wave of leaks, the design of the device has been unveiled via leaked presentation slides.
The presentation slides disclose a design that is quite identical to the Pro 5 smartphone but with a twist.
According to the slides, Meizu Pro 6 will come in a metal unibody design with curved corners along with a fingerprint scanner mounted inside the home button at the front. The display appears to be bezeless, which could be referred to as an exclusive 2.5D curved glass style identical to the one seen in Oppo R7 Plus. In addition, the antenna lines have also been improved.
There is a big snapper module at the rear with a single LED flash. However, there is no laser mechanism for the focus. Additional specs of the device include a 5.5-inch display with 1080p screen resolution. The device is rumored to sport 4GB of RAM along with 64GB on board internal storage. Meizu Pro 6 will be driven by Deca-core Helio X25 SoC clocked at 2.5GHz.
In terms of camera, the handset is speculated to feature a 21MP back camera with f/2.0 and it will run on Android 6.0 Marshmallow out of the box.
Connectivity options will include WIFI 802.11a/b/g/n/ac, Bluetooth 4.2, NFC and USB Type C connectivity. The device will encompass the accelerometer, fingerprint, proximity, compass and gyro sensors.
